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    Home /News /Engineering plastics /Laperos LCP resin Overview /

    Laperos LCP resin Overview

    2026-10-16

    1. What is Laperos LCP resin?

    Laperos LCP resin

    LCP, also known as liquid crystal polymer, is a type of thermoplastic resin. It gets its name from the fact that its molecules are arranged in an ordered, liquid-crystal-like state when in a molten state. It is precisely this structure that gives the material extremely high rigidity and the ability to form ultra-thin-walled products.

    Laperos liquid crystal polymer (LCP) is a material developed by Polyplastics for use in electronic connectors, surface-mount technology (SMT) components, and other precision parts. Its key characteristics include extremely low water absorption, high rigidity, excellent thin-wall molding performance, and high-temperature resistance.

    2. Properties of Laperos LCP Resin

    • Ultra-Thin-Wall Molding: Laperos LCP exhibits high melt flow rates; some ultra-high-flow grades have MFI values far exceeding those of typical resin materials, making them particularly suitable for fine-pitch connectors and complex electrical components.
    • Temperature resistance: Generally, Laperos LCP resin can withstand temperatures of 220°C or higher. It is a material specifically developed for high-temperature applications and is particularly well-suited for high-temperature reflow soldering, a soldering technique used in the assembly of electronic components.
    • Low water absorption and dimensional stability: Compared to traditional polymer materials, Laperos LCP has a water absorption rate of less than 0.01, which helps maintain dimensional accuracy in applications with tight tolerance requirements.
    • Electrical Insulation and Flame Retardancy: Typically, Laperos LCP meets the UL 94 V-0 standard for flame retardancy, while also offering excellent insulation properties; its extremely low water absorption rate further enhances its insulation performance in humid environments.

    3. Applications of Laperos LCP 

    LCP material Terminal Connector Housing

    Electronic and electrical connectors

    Laperos LCP resin is the material of choice for micro-connector housings, fine-pitch terminal assemblies, and other precision parts; thanks to its excellent dimensional stability and ultra-thin-wall molding capabilities, it accounts for more than 30% of the LCP market.

    LCP material Optical Communication Components

    Optical Communication Components

    In multi-fiber connector systems and high-density optical interconnects, precise alignment and compact structural design are critical. Appropriately selected Laperos LCP grades can support the molding of complex connector components.

    LCP material SMT PCB board

    SMT - Surface-Mount Technology

    SMT is an electronic assembly technology in which leadless or short-lead electronic components are directly placed and soldered onto specified pads on the surface of a printed circuit board (PCB). Since soldering requires temperatures exceeding 200°C, there are few materials capable of withstanding these conditions; among them, Laperos LCP is an excellent alternative material.

    4. Comparison of the Physical and Mechanical Properties of Laperos LCP Resin

    LAPEROS is not a single resin grade. Its portfolio includes materials optimized for different combinations of strength, stiffness, flowability, heat resistance and dimensional stability. The manufacturer's connector selection guide specifically differentiates between long connectors, fine-pitch thin-wall connectors and flat or grid-array components. The following is a comparison of Laperos’ best-selling LCP resin grades
    Table 1. Representative LAPEROS LCP properties

    Property

    Unit / method

    E130i

    A130

    E471i

    S471

    Characteristic

    GF reinforced; High strength

    High toughness

    Low warpage

    Heat resistance

    Density

    g/cm³, ISO 1183

    1.61

    1.61

    1.67

    1.77

    Water absorption, 23°C/24 h

    %, ISO 62

    0.03

    0.02

    -

    0.01

    Tensile strength

    MPa, ASTM D638

    175

    210

    140

    130

    Tensile elongation

    %, ASTM D638

    2.0

    2.2

    2.3

    2.0

    Flexural strength

    MPa, ISO 178

    220

    270

    -

    180

    Flexural modulus

    MPa, ISO 178

    15,000

    15,000

    13,500

    12,700

    Notched Charpy impact strength at 23°C

    kJ/m², ISO 179/1eA

    35

    20

    6

    HDT at 1.8 MPa

    °C, ISO 75

    280

    240

    265

    315

    UL 94 rating

    Manufacturer data

    V-0

    V-0

    V-0

    V-0
    Table 2. Recommend LAPEROS LCP grade by applications

    Application

    Grade of recommend

    Reasons for the Recommendation
    Surface Mount Technology (SMT) 
    Electronic Connectors

    Laperos E series

    (E130i E471i E473i)

    High temperature resistance

    Load bearing components

    Laperos A series

    (A130)

    High strength, High toughness

    Ultra thin wall application

    Laperos TF series

    Ultra high flow

    5G RF Applications

    Laperos E525

    Low fibrillation

    4.1 Why is the Laperos E Series LCP Better Suited for SMT?

    Taking Laperos E130i liquid crystal polymer as an example, its heat deflection temperature is 280°C, which meets the 245–260°C temperature range required for high-temperature reflow soldering used in the SMT assembly process; its moisture absorption rate is only 0.03%, ensuring dimensional stability in precision electronic components, particularly fine-pitch connectors.
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